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Technology
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ReRAM Memory Module Technology
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All
0-9
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
0-9
1S1R
1T1R
4F
2
A
Access Time
Analog ICs
B
BCD / BCDMOS
BEOL Memory
Bit Cell
Bit Error Rate (BER)
C
Characterization
Chip
CMOS
CPU
Cross-Section
Crossbar
D
Data Retention
Die
Discrete Memory
DPM (Defects Per Million)
DRAM
E
ECC (Error Correction Code)
eFlash – Embedded Flash
Embedded Memory / Embedded NVM
Emerging Memory / Emerging NVM
Endurance
F
Fab
FDSOI
FEOL (Front-End-of-Line) Memory
Flash
FRAM (Ferroelectric Random Access Memory)
G
Geometry
H
HRS (High Resistance State)
I
IC (Integrated Circuit)
In-Memory Compute / Processing In-Memory
L
LRS (Low Resistance State)
M
Mask
Memory Cell
Memory Module
Memristor
Microcontroller (MCU)
MRAM
MTP (Multi-Time Programmable)
N
NAND (3D) Flash
NAND Flash
Nanometer (nm)
Neuromorphic Computing
Non-volatile Memory (NVM)
NOR Flash
O
OTP (One-Time Programmable)
Oxide
OxRAM
P
PCM (Phase Change Memory)
PDK – Process Design Kit
Persistent Memory (PM)
PMIC
Q
Qualification
R
Radiation Tolerant / Radiation Hardened (Rad Hard)
RAM
ReRAM
Retention
RRAM
S
Selector
Silicon
SiOx
Spiking neural networks (SNNs)
SRAM
Storage Class Memory (SCM)
System-on-a-Chip (SoC)
T
Tape-out
Transistor
V
Volatile Memory
W
Wafer
Wafer Level Packaging (WLP) / Wafer Level Chip Scale Packaging (WLCSP)
Y
Yield
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